A practical overview of SMT inspection techniques used in modern PCBA manufacturing.
SMT inspection helps catch solder defects, misaligned components, missing parts, and polarity errors before a PCB assembly leaves the factory. In PCBA manufacturing, inspection is one of the most important tools for maintaining yield and customer confidence.
Automated optical inspection is widely used to detect visible solder and placement issues on PCB assemblies after reflow or selective soldering.
X-ray inspection is especially useful for BGA, QFN, and other packages where the solder joint is not visible from the surface of the PCBA.
Functional testing confirms that the assembled PCB performs as expected, which is critical before shipment or integration into a final product.